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Engineering Discipline

Higher Diploma in Computer and Electronic Engineering

Programme code EG114403

The following section presents the programme information offered in September 2021. Information of programmes to be offered in academic year 2022/23 will be announced later.
Curriculum
Semester 1 :
  • English and Communication : Workplace Interaction
  • Whole Person Development - MindShift : Achieving Personal Growth & Effectiveness
  • Information Technology Essentials - Technical
  • Mathematics
  • Electronics Essentials
  • Computer and Electronic Practices
  • Computer Programming for Microcontroller
Semester 2 :
  • English and Communication : Workplace Correspondence
  • Vocational Chinese Communication : Putonghua Conversation and Reports
  • Augmented and Virtual Reality Engineering
  • Communications and Network Engineering
  • Embedded Systems
  • Object-oriented and Mobile Device Programming
Semester 3 :
  • English and Communication : Persuasive Presentations
  • Sensor Technology and Applications
  • Artificial Intelligence, Big Data and Cyber Security
  • Engineering Mathematics
Semester 4 :
(Students are required not only to study the common modules, but also to study two elective modules)
  • English and Communication : Promotional Materials
  • Whole Person Development - Collaboration, Teamwork & Social Engagement
  • Internet-of-Things Technology and Applications
  • Enrichment Module
Elective Modules (any 2) :
  • Electronic Product Design
  • Electronic Systems Engineering
  • Modern Communications Technology
  • Networked Mobile Application Development
  • Network Streaming and Broadcasting
  • Server Installation and Programming
  • Computer Vision and Image Processing
  • Control Systems and Applications
  • Robotics and Automation
Semester 5 :
  • English and Communication : Reports
  • Vocational Chinese Communication : Putonghua Presentations, Administrative and Technical Text Writing
  • Whole Person Development - Enhancing Competencies in the 21st Century Workplace
  • Industrial Attachment
  • Industry-Based Student Project